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SX1231
WIRELESS & SENSING PRODUCTS
Table of contents
Section
DATASHEET
Page
5.4.
Continuous Mode ...........................................................................................................................................51
5.4.1. General Description................................................................................................................................... 51
5.4.2. Tx Processing............................................................................................................................................ 51
5.4.3. Rx Processing ........................................................................................................................................... 52
5.5.
Packet Mode .................................................................................................................................................. 52
5.5.1. General Description................................................................................................................................... 52
5.5.2. Packet Format ........................................................................................................................................... 53
5.5.3. Tx Processing (without AES)..................................................................................................................... 55
5.5.4. Rx Processing (without AES) .................................................................................................................... 56
5.5.5. AES ........................................................................................................................................................... 56
5.5.6. Handling Large Packets ............................................................................................................................ 58
5.5.7. Packet Filtering.......................................................................................................................................... 58
5.5.8. DC-Free Data Mechanisms....................................................................................................................... 60
6.
Configuration and Status Registers ....................................................................................................................... 62
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
6.7.
6.8.
General Description ....................................................................................................................................... 62
Common Configuration Registers ..................................................................................................................65
Transmitter Registers .....................................................................................................................................68
Receiver Registers .........................................................................................................................................69
IRQ and Pin Mapping Registers ....................................................................................................................71
Packet Engine Registers ................................................................................................................................73
Temperature Sensor Registers...................................................................................................................... 76
Test Registers................................................................................................................................................ 76
7.
Application Information .......................................................................................................................................... 77
7.1.
7.2.
Crystal Resonator Specification..................................................................................................................... 77
Reset of the Chip ........................................................................................................................................... 77
7.2.1. POR........................................................................................................................................................... 77
7.2.2. Manual Reset ............................................................................................................................................78
7.3.
Reference Design .......................................................................................................................................... 78
8.
Packaging Information ........................................................................................................................................... 81
8.1.
8.2.
8.3.
8.4.
QFN 24 Encapsulation................................................................................................................................... 81
TSSOP 28 Encapsulation ..............................................................................................................................82
Thermal Impedance ....................................................................................................................................... 82
Tape & Reel Specification.............................................................................................................................. 83
9.
Chip Revisions....................................................................................................................................................... 84
9.1.
9.2.
RC Oscillator Calibration................................................................................................................................ 84
Listen Mode ...................................................................................................................................................85
9.2.1. Resolutions................................................................................................................................................ 85
9.2.2. Exiting Listen Mode ................................................................................................................................... 85
9.3.
OOK Floor Threshold Default Setting ............................................................................................................ 85
Rev. 7 - June 2013
Page 4
www.semtech.com
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